Nikon Metrology / Products / X-ray and CT Inspection / X-ray systems for electronics inspection

X-ray and CT Inspection

X-ray and CT technology for electronics inspection

To cope with the demands of ever-smaller electrical components and comply with tighter quality standards, Nikon Metrology introduced flexible, high-resolution and cost-effective inspection systems. High-precision proprietary X-ray technology built into the XT V 130C and XT V 160 X-ray inspection systems facilitate defect analysis of loaded PCB boards in a smooth non-destructive process. Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection, these compact, easy-to-use and cost-effective inspection systems are indispensable in any electronics production area.