Nikon Metrology / Applications / Electronics



From silicon wafers to electronic devices mounted on multi-layer PCBs. Nikon Metrology offers a range of non-contact inspection systems capable of monitoring high-pace production and in-depth investigation. 


Showing: Electronics

  • BGA voids
    X-ray inspection of BGA, wirebonds, MEMS, loaded PCB

    With the advent of many newer type components such as BGA and flip-chip devices; traditional microscope inspection is not an option as the majority of solder con...

  • Wafers

    At the heart of almost every electronic product are wafers, thin slices of semiconductor materials on which microcircuits are constructed through the diffusion a...

  • Liquid Crystal Displays (lcd)
    Liquid Crystal Displays (lcd)

    Door hun slanke design en geringe voetafdruk, worden platte lcd-schermen aan hoog tempo het favoriete formaat voor televisies en monitors van computers en werkst...

  • MEMS

    In today's world increasingly miniaturised electronic products, Microelectromechanical systems (MEMS) and Nanoelectromechanical systems (NEMS) sets the standards...

  • Microelectronics

    Smaller, cheaper, faster - these are the ever-present concerns of microelectronic device manufacturers. In this industry, each new generation of products must ou...

  • Optoelectronics

    From fibre-optic communications and wireless networks, to optical storage devices and advanced medical equipment, optoelectronics are becoming an increasingly vi...